Technologies

JSC MERI owns a number of technologies necessary for the production of analog power management, RFID chips, microprocessors, microcontrollers, and other types of integrated circuits. JSC MERI the constant development of the technological portfolio and its implementation in production to ensure the possibility of manufacturing new types of chips. 


FAB 200
Integrated circuits with 6-8 layers of metallization and design standards from 250 to 65 nm are under production.
CMOS 65 nm
Microprocessors and microcontrollers
CMOS 90 nm
- High-performance multipurpose microcontrollers and microprocessors
- VLSI memory, GLONASS navigation, and VLSI digital television
- ICs for industrial applications, etc.
CMOS EEPROM 0.18 μm
- RFID chips, public transport tickets, etc.
- Smart card ICs (identification documents)
- Microcontrollers and specialized VLSI with low power consumption
Technology HCMOS065_LP_8M_1.2V. Power (core / I / O) - 1.2 / 2.5. Quantity #Me - 8 Cu + 1Al.
Technology HCMOS10_LP_7M_2.5V. Power (core / I / O) - 1.2 / 2.5. Quantity #Me - 7. Technological options - RF devices, Thick Me, HIPO, MIM. Developer options PDK, Stdcells, I/O. RAM compiler single port. ROM compiler. IPs. Status "Assimilated".
Technology CMOSF8_6M_5V. Power (core / I / O) - 1.8 / 5. Quantity # Me - 6.
Technological options - THick Me, HIPO, MIM. Developer options EEPROM, PDK, Stdcells, I / O. RAM compiler single port. ROM compiler. IPs. Status "Assimilated".
CMOS 0.18 μm 36 V
- High-performance multipurpose microcontrollers and microprocessors
- VLSI memory, GLONASS navigation, and VLSI digital television
- High-performance DA/AD converters, etc.
CMOS 0.18 μm 5 V
- High-performance multipurpose microcontrollers and microprocessors
- VLSI memory, GLONASS navigation, and VLSI digital television
- High-performance DA/AD converters, etc.
CMOS 0.18 μm 3.3 V
- High-performance multipurpose microcontrollers and microprocessors
- VLSI memory, GLONASS navigation, and VLSI digital television
- High-performance DA/AD converters, etc.
Technology HCMOS8D_6M_3.3V. Power (core / I / O) - 1.8 / 36 / 3.3. Quantity #Me - 6. Technological options - HIPO, MIM. Developer options PDK. Status "Assimilated". Allows for the application of the design methodology “Radiation hardening by design”.
HCMOS8D_6M_5V technology. Power (core / I / O) - 1.8 / 5 / 3.3. Quantity #Me - 6. Technological options - HIPO, MIM, OTP. Developer options PDK, Stdcells, I / O. RAM compiler single port. ROM compiler. IPs. Status "Assimilated". Allows for the application of the design methodology “Radiation hardening by design”.
Technology HCMOS8D_6M_3.3V. Power (core / I / O) - 3.3 / 3.3. Quantity #Me - 6. Technological options - HIPO, MIM. Developer options PDK, Stdcells, I / O. RAM compiler single port. ROM compiler. IPs. Status "Assimilated". Allows for the application of the design methodology “Radiation hardening by design”.