Products and services

MERI is a leading design center for RFID crystals. The institute has developed and commercialized crystals for transportation applications, electronic documents, product labeling, animal and pharmaceutical labeling and other applications. These microchips have successfully passed testing in domestic and international certification laboratories.

Product and services

Smart cards and RFID

MERI is a leading design center in the field of crystal design for RFID applications. MERI develops a secure microcontroller’s family for transport applications, electronic documents, product labeling, animals, medicines, postal items, and other applications.

MERI develops chips for transport cards and access control systems (ACCS) compatible with Mifare Plus, as well as security modules (SAMs) for embedding in terminals and validators, providing support for the cryptographic protocol for interacting with Mifare Plus cards.

CMOS technologies
Non-volatile memory

Smart сard application development

MERI has a unique experience in developing operating systems for smart cards, in-depth knowledge of hardware, standards, and specifications in the field of smart technologies. The Institute provides a full range of application development services based on customer requirements.

RFID tags

MERI has developed a unique set of microchips that are currently used in transport tickets, product labeling, and smart cards for various purposes: electronic medical policies, bankcards, new-generation electronic passports and access system cards.

3D packaging technologies
Non-volatile memory

IP blocks

MERI provides customers with complex-functional blocks (IP-blocks) for various purposes ensuring the necessary balance between their cost, the final product creation’s timing and the engineering resources’ amount. The IP portfolio includes libraries of standard digital cells and I/O elements, various types of memory blocks, analog IPs, IP interfaces, etc.

Integrated circuits

MERI chips are used in control systems, telecommunications systems, and industrial Internet.

3D packaging technologies