On an ongoing basis our company works with more than 60 leading global and domestic companies, including leading semi-conductor companies, science centers, technological universities and design centers.
MERI works towards the development of new technologies and products with the following institutions of the Russian academy of science:
Federal budget institution of science "Institute of radiotechnology and electronics V.A. Kotelnikov, of the Russian academy of science", Moscow.
The Saratov branch IPE Kotelnikov of the Russian academy of science (Saratov)
- Technology for the creation of integral auto emission devices.
Federal budget institution of science "Institute of semi-conductor physics SO, Russian academy of science" (Novosibirsk)
- Energy-independent memory (Elemental base, technology)
- Technology of structures "Silicon on insulators" for radiation-resistant VLSI
- Integration of CMOS technologies on silicon and microwave elements GaAs/GaN
Federal Budget Institution of science "Institute for inorganic chemistry A.V. Nikolaevna of the Russian academy of science" (Novosibirsk)
- Materials for the technology of deposition of low-k dielectrics for multiple-level metallization of VLSI with projects norms of 90-65-45 nm
Federal Budget Institution of science "St Petersburg Academic university- Science education center of nanotechnology of the Russian academy of science" (St Petersburg)
- - Nanoelectrode matrices for bioelectronic interface systems;
Federal Budget Institution of science "Institution for communication issues A.A. Kharkevicha, Russian academy of science" (Moscow)
- The development of the theoretical foundations and practical methods of increasing malfunction tolerance of VLSI memory under conditions of the influence of lone particles of cosmic radiation
Federal Budget Institution of science "Institute of general and inorganic chemistry N.S. Kurnakov of the Russian academy of science" (Moscow).
Federal Budget Institution of science "Institute of general physics Prokhorov of the Russian academy of science" (Moscow)
Federal Budget Institution of science "Physics institute Lebedev of the Russian academy of science" (Moscow).
Federal Budget Institution of science "Institute of crystallography of the Russian academy of science" (Moscow).
Federal Budget Institution of science "Physio-technological institute of the Russian academy of science" (Moscow)
The Yaroslavl branch of the Federal Budget Institute of science "Institute of physics and technology of the Russian academy of science" (Yaroslavl).
"NIIME" carries out joint projects with global science centers of microelectronics:
Interuniversity Microelectronics Centre (Leuven, Belgium)
CEA-Leti (Grenoble, France)
Fraunhofer-Gesellschaft (Munich, Germany)
Technische Universiteit Delft (Delft, Netherlands),
Ecole Speciale de Lausanne (Lausanne, Switzerland)
Aselta Nanographics (Grenoble, France),
Leland Stanford Junior University, (Stanford, California, USA)
Katholieke Universiteit Leuven(Leuven, Belgium)
Technological partnership with global companies:
Mapper Lithography (Delft, Netherlands),
STMircoelectronics (Geneva, Switzerland)
Silicon Storage Technology
IHP (Hannover, Germany)
ASML Holding N.V. (Veldhoven, Netherlands)
SVCS Process Innovation s.r.o. (Brno, Czech Republic)
Rigaku Corporation (Germany)
Edwards Limited (United Kingdom)
IHP (Germany)-BiKMOP technology made for the integration of germanium-silicon (SiGe) bipolar transistors into silicon technology 0.18mkm SEMI.
EuroTex (Belgium). Cooperation in seeking out and developing connections and contacts among European scientific and research organizations. Collaboration with foreign research centers and organizations as well as producers of technological and research equipment for the semi-conductor industry.
OXFORD INSTRUMENTS (United Kingdom). "NIIME" is working with this company in the area of the processes and equipment for the deposition and the etching of new promising materials for the future technology of the creation of integral circuits
APPLIED MATERIALS (USA). Cooperation in the area of optimizing decisions for the processes of the deposition of semi-conductor materials, dry etching, chemical-mechanical polishing of layers which are used in traditional CMOS technology as well as in MEMS and 3D-assembly technologies.
LAW RESEARCH (USA). The search for solutions for deep dry etching in MEMS and 3D-assembly technologies.
TOPPAN PHOTOMASK (Japan) Cooperation regards matters related to the correction of information taking into account the effects of optical vicinity.
VTT (Finland)- Interests relating to the technology of the building Ics without a package, and the development of collateral technological processes.
TSMC (Taiwan). Cooperation aimed at dealing with questions related to prototypes of developed integral circuits as well as discussing questions related to cooperation in the sphere of MEMS technologies and 3D-assembly.
Abakama LLC (USA) – Options are being dicussed for cooperation in the development of IP-cores.
- Participation in the EU Framework Program - FP7
- Participation in international conferences
- Development of technologies
- Creation of high-tech products