System-in-Package: Design and production conference

Conference “System-in-Package: design and production” was held in Moscow on March 28. The conference was organized by information and analytic ‘Center of Modern Electronics’. It was targeted at  microchips and SoC manufacturers, , electronic equipment manufacturers as well as at technologists, production managers and technological equipment suppliers.

MERI’s chief of the UHF devices development laboratory  Gleb Baranov, chief of the functional electronics department laboratory Pavel Zakharov, and deputy chief of the power supplies schemes development department Viacheslav Khudiakov attended the conference to get an overview with the up-to-date technologies and to share best practices  with colleagues.

Leading Russian SiP development companies’ speakers reported on the results of their work and achievements: implementation of the technologies of crystals multi-layer mounting in BGA/LGA packaging with wire unwinding; implementations of Flip-chip mounting technology and 2.5D(PoP)/3D integration using active and passive interposers; development of memory modules with 3D-TSV technology that contains up to 10 silicon crystals and multi-crystals modules including digital isolators. Speakers also considered different design environments for SiP engineering.  

Although SiP technologies are fast growing in the world, for Russian manufacturers 3D-TSV technology is still underdeveloped.  Nevertheless, there are certain achievements in this field demonstrated by several Russian companies.

MERI experts highlighted the reports about using LTCC-based SiP technologies that are relevant for microwave devices due to low-loss dielectric transitions of the material, high electrical conductivity of the implemented metallization and capability to integrate them in heat drains modules.